The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Mar. 15, 2013
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Kuo-Hua Chen, Kaohsiung, TW;

Chih-Wei Chang, Yangmei, TW;

Jin-Chern Chiou, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/0478 (2006.01); A61B 5/00 (2006.01); A61B 5/04 (2006.01); A61B 5/0492 (2006.01); H01L 23/48 (2006.01); A61B 5/0496 (2006.01); A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
A61B 5/0478 (2013.01); A61B 5/04001 (2013.01); A61B 5/0492 (2013.01); A61B 5/6868 (2013.01); H01L 23/481 (2013.01); A61B 5/0496 (2013.01); A61B 2562/028 (2013.01); A61B 2562/043 (2013.01); A61N 1/0529 (2013.01);
Abstract

The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion, a plurality of microprobes and at least one conductive via. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The through silicon via is disposed in the base and electrically connects the integrated circuit portion and the microprobes. Each of the microprobes includes an isolation layer partially covering a conductive layer.


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