The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Jan. 13, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Hideyuki Tomizawa, Gunma-ken, JP;

Akihiro Kojima, Ishikawa-ken, JP;

Miyoko Shimada, Kanagawa-ken, JP;

Yosuke Akimoto, Tokyo, JP;

Miyuki Shimojuku, Kanagawa-ken, JP;

Hideto Furuyama, Kanagawa-ken, JP;

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/44 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/44 (2013.01); H01L 33/46 (2013.01); H01L 2933/0033 (2013.01);
Abstract

According to one embodiment, the optical layer has a larger planar size than the semiconductor layer. The optical layer is transmissive to emission light of the light emitting layer. The first insulating film is provided on a side surface of the semiconductor layer continued from the first surface. The metal film includes a first reflective part covering the side surface of the semiconductor layer via the first insulating film. The metal film includes a second reflective part opposed to the optical layer in a region around the side surface of the semiconductor layer and extending from the first reflective part toward a side opposite from the side surface of the semiconductor layer.


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