The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
May. 07, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G11C 29/12 (2006.01); G11C 5/02 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G11C 29/12 (2013.01); G01R 31/2818 (2013.01); G11C 5/025 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06596 (2013.01);
Abstract
An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.