The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jan. 09, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Philip H. Bowles, Gilbert, AZ (US);
Paige M. Holm, Phoenix, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
Raymond M. Roop, Scottsdale, AZ (US);
FREESCALE SEMICONDUCTOR,INC, Austin, TX (US);
Abstract
A method () entails providing () a structure (), providing () a controller element (), and bonding () the controller element to an outer surface () of the structure. The structure includes a sensor wafer () and a cap wafer () Inner surfaces () of the wafers () are coupled together, with sensors () interposed between the wafers. One wafer () includes a substrate portion () with bond pads () formed on its inner surface (). The other wafer () conceals the substrate portion (). After bonding, methodology () entails forming () conductive elements () on the element (), removing () material sections () from the wafers to expose the bond pads, forming () electrical interconnects (), applying () packaging material (), and singulating () to produce sensor packages ().