The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Mar. 14, 2012
Po-jen Wang, Taichung, TW;
Hsiang-hui Tsai, Tainan, TW;
Ying-chen Chiu, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method for controlling device feature sizes produced by polishing operations such as chemical mechanical polishing (CMP) is provided. The method includes instituting process controls to control the processing operations used in combination to produce features of a metal layer with a desired thickness, based on the thickness of the previous metal layer or layers. A target thickness for first and second metal layers is established. After the first metal layer is produced and the difference between the first metal target thickness and the actual first metal thickness is determined, the target thickness for the second metal features is adjusted. Once the target thickness for the second metal features is adjusted, each of the processing operations used to produce the second metal layer is controlled in combination to produce the second metal features with the adjusted target thickness.