The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Nov. 08, 2012
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

David W. Song, Chandler, AZ (US);

Je-Yong Chang, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H05K 3/30 (2006.01); H01L 23/427 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H05K 7/20272 (2013.01); H01L 23/427 (2013.01); H01L 2224/16 (2013.01); H01L 2224/73253 (2013.01); H05K 1/0209 (2013.01); H05K 3/30 (2013.01); H05K 7/20218 (2013.01); H05K 2201/066 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.


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