The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Apr. 25, 2012
Applicants:

Xinming Wang, Tokyo, JP;

Mitsuru Miyazaki, Tokyo, JP;

Kunimasa Matsushita, Tokyo, JP;

Inventors:

Xinming Wang, Tokyo, JP;

Mitsuru Miyazaki, Tokyo, JP;

Kunimasa Matsushita, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/024 (2013.01);
Abstract

A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×r=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance 'r' from the center of the substrate, and α represents a power index.


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