The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Dec. 05, 2013
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
I-Shuo Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
Systems and methods are provided for performing chemical-mechanical planarization on an article. An example system for performing chemical-mechanical planarization includes: a polishing pad configured to support an article for chemical-mechanical planarization (CMP), wherein the article includes a CMP stop material, a polishing head configured to perform chemical-mechanical planarization on the article, a light source configured to provide an incident light, a polishing fluid including a plurality of luminescent particles capable of emitting a fluorescent light in response to the incident light, a fluorescence detector configured to detect the intensity of the fluorescent light, and at least one processor coupled to the fluorescent detector and the polishing head, wherein the at least one processor is configured to control the polishing head based on the detected fluorescent light.