The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jan. 17, 2014
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); G11C 5/06 (2006.01); H01L 27/105 (2006.01); H01L 27/115 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
G11C 5/063 (2013.01); H01L 27/11548 (2013.01); H01L 27/11575 (2013.01); H01L 27/0688 (2013.01); H01L 27/1052 (2013.01); H01L 27/115 (2013.01); H01L 27/11521 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract
Wiring structures of three-dimensional semiconductor devices and methods of forming the same are provided. The wiring structures may include an upper wordline and a lower wordline, each of which extends in a longitudinal direction. The upper wordline may include a recessed portion that extends for only a portion of the upper wordline in a transverse direction and the lower wordline may include a wiring area exposed by the recessed portion of the upper wordline. The wiring structures may also include an upper contact plug contacting the upper wordline and a lower contact plug contacting the wiring area. The upper and lower contact plugs may extend in a vertical direction.