The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Dec. 21, 2011
Applicants:

Harunari Hasegawa, Nirasaki, JP;

Kippei Sugita, Nirasaki, JP;

Atsushi Ando, Nirasaki, JP;

Yoshiki Fukuhara, Nirasaki, JP;

Makoto Takahashi, Oshu, JP;

Inventors:

Harunari Hasegawa, Nirasaki, JP;

Kippei Sugita, Nirasaki, JP;

Atsushi Ando, Nirasaki, JP;

Yoshiki Fukuhara, Nirasaki, JP;

Makoto Takahashi, Oshu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); C23C 16/52 (2006.01); C23C 16/06 (2006.01); C23C 16/22 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45578 (2013.01); C23C 16/455 (2013.01); C23C 16/458 (2013.01); C23C 16/4584 (2013.01); C23C 16/45563 (2013.01); C23C 16/45576 (2013.01); C23C 16/52 (2013.01);
Abstract

Provided is a film forming apparatus for forming a film on a substrate maintained within a film forming container by supplying a raw material gas to the substrate. The film forming container includes a substrate maintaining unit, a supply mechanism configured to include a supply pipe with supply holes formed thereon to supply a raw material gas to the interior of the film forming container through the supply holes, an exhaust mechanism configured to include an exhaust pipe with exhaust holes formed thereon to exhaust gas from the interior of the film forming container through the exhaust holes, and a controller configured to control the substrate maintaining unit, the supply mechanism, and the exhaust mechanism. The supply holes and the exhaust holes are formed to face each other with the substrate maintained in the substrate maintaining unit interposed therebetween.


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