The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Sep. 26, 2013
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Yoshikazu Tsuzuki, Osaka, JP;

Yoshimasa Nishida, Osaka, JP;

Takafumi Suzuki, Osaka, JP;

Hiromitsu Morishita, Osaka, JP;

Masayoshi Natsume, Osaka, JP;

Shuuji Sugimoto, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B32B 37/15 (2006.01); B32B 37/26 (2006.01); B32B 38/04 (2006.01); B60R 13/00 (2006.01); C09J 7/00 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
B60R 13/005 (2013.01); B32B 37/14 (2013.01); C09J 7/00 (2013.01); C09J 2201/28 (2013.01); C09J 2201/606 (2013.01); Y10T 83/0341 (2015.04); Y10T 156/1062 (2015.01); Y10T 156/11 (2015.01);
Abstract

A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape. The second slit has a discontinuous portion in a cutting direction.


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