The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Oct. 24, 2012
Applicant:

Southeast University, Jiangsu, CN;

Inventors:

Weifeng Sun, Jiangsu, CN;

Siyang Liu, Jiangsu, CN;

Jing Zhu, Jiangsu, CN;

Qinsong Qian, Jiangsu, CN;

Shen Xu, Jiangsu, CN;

Shengli Lu, Jiangsu, CN;

Longxing Shi, Jiangsu, CN;

Assignee:

SOUTHEAST UNIVERSITY, Jiangsu, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); H01L 29/739 (2006.01); H01L 29/40 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7394 (2013.01); H01L 27/1203 (2013.01); H01L 29/0638 (2013.01); H01L 29/404 (2013.01); H01L 27/0623 (2013.01);
Abstract

A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.


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