The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jul. 19, 2012
Applicants:
Jong-han Shin, Gyeonggi-do, KR;
Jum-yong Park, Gyeonggi-do, KR;
Inventors:
Jong-Han Shin, Gyeonggi-do, KR;
Jum-Yong Park, Gyeonggi-do, KR;
Assignee:
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/108 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10876 (2013.01); H01L 27/10855 (2013.01); H01L 27/10888 (2013.01); H01L 29/4236 (2013.01);
Abstract
A method for fabricating a semiconductor device includes forming landing plugs over a substrate, forming a trench by etching the substrate between the landing plugs, forming a buried gate to partially fill the trench, forming a gap-fill layer to gap-fill an upper side of the buried gate, forming protruding portions of the landing plugs, and trimming the protruding portions of the landing plugs.