The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 24, 2013
Applicant:
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Inventor:
Wei-Shuo Su, Taoyuan, TW;
Assignee:
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49822 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68377 (2013.01);
Abstract
A packaging substrate includes a first wiring layer, a first dielectric layer formed on the first wiring layer, a second wiring layer formed on the first dielectric layer, and a number of copper pillar bumps. Each copper pillar bump includes a base portion and a protruding portion. The base portion is connected to the first wiring layer, and the protruding portion is formed on the base portion. A size of the protruding portion is less than a size of the base portion, and a size of the copper pillar bump gradually increases from the protruding portion to the base portion.