The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Feb. 07, 2011
Applicants:
Daniel T. Hurley, Waterbury, VT (US);
Gregory George, Colchester, VT (US);
Inventors:
Daniel T. Hurley, Waterbury, VT (US);
Gregory George, Colchester, VT (US);
Assignee:
SUSS MicroTec Lithography GmbH, Garching, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23B 31/30 (2006.01); H01L 21/67 (2006.01); B23Q 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B23Q 3/088 (2013.01); H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 21/6838 (2013.01); B23B 31/307 (2013.01); H01L 21/6836 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68381 (2013.01); Y10T 279/11 (2015.01);
Abstract
An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.