The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 06, 2012
Mpi Corporation, Chu-Pei, Hsinchu Shien, TW;
Chung-Tse Lee, Hsinchu Hsiang, TW;
Chien-Chou Wu, Hsinchu-Hsiang, TW;
Yi-Ming Chan, Hsinchu Hsiang, TW;
MPI CORPORATION, Chu-Pei, Hsinchu Shien, TW;
Abstract
A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate.