The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jul. 08, 2014
Applicant:
Innovative Micro Technology, Goleta, CA (US);
Inventors:
Benedikt Zeyen, Santa Barbara, CA (US);
Jeffery F. Summers, Santa Barbara, CA (US);
Assignee:
Innovative Micro Technology, Goleta, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 21/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/04 (2006.01); H01L 31/0203 (2014.01); H01L 33/48 (2010.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0067 (2013.01); B81C 1/00317 (2013.01); H01L 23/04 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 33/483 (2013.01); B81B 2201/047 (2013.01); B81B 2207/093 (2013.01); B81C 2203/019 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/031 (2013.01); H01L 2933/0033 (2013.01);
Abstract
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a Second bond, for example a metal alloy, solder, eutectic and polymer bond. The two bonds may be used for the same or a different purpose, and may be selected for the following attributes: hermeticity, electrical conductivity, low RF loss, high adhesive strength, leak resistance, thermal conductivity. The attributes for each bonding technology may be the same, or they may be different.