The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Mar. 14, 2013
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Tse Nga Ng, Palo Alto, CA (US);

JengPing Lu, Fremont, CA (US);

Eugene M. Chow, Fremont, CA (US);

Timothy David Stowe, Alameda, CA (US);

Janos Veres, San Jose, CA (US);

Philipp H. Schmaelzle, Los Altos, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/38 (2006.01); B29C 67/00 (2006.01); B29C 33/44 (2006.01); B29C 33/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/3835 (2013.01); B29C 33/3842 (2013.01); B29C 33/448 (2013.01); B29C 67/0051 (2013.01); B29C 67/0055 (2013.01); B29C 33/005 (2013.01); B29C 2033/385 (2013.01);
Abstract

A replica 3D structure is fabricated inside a multi-layered mold by patterning each mold layer to define a void/opening that matches a corresponding cross section of the structure's peripheral surface, and filling the patterned opening of each layer with a structural material (i.e., before depositing a subsequent layer of mold material). The mold material (e.g., photoresist or another dissolvable sacrificial material) is blanket deposited (e.g., by slot-die, spray coating) and then patterned using a laser or a printed mask. Each layer of modeling material (e.g., polymer, ceramic or metal, or a combination thereof) is electro-plated or otherwise deposited on the previously formed modeling material layer. High vertical resolution is achieved by utilizing relatively thin mold layers. The mold layer deposition, patterning and modeling material deposition is repeated until the replica 3D structure is entirely formed inside the multi-layered mold, and then the mold is dissolved or otherwise removed.


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