The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Apr. 30, 2012
Akihiro Sato, Ichinoseki, JP;
Masahiro Sasaki, Ichinoseki, JP;
Tadahiro Ohmi, Sendai, JP;
Akihiro Morimoto, Sendai, JP;
Akihiro Sato, Ichinoseki, JP;
Masahiro Sasaki, Ichinoseki, JP;
Tadahiro Ohmi, Sendai, JP;
Akihiro Morimoto, Sendai, JP;
DAISHO DENSHI CO., LTD., Tokyo, JP;
TOHOKU UNIVERSITY, Miyagi, JP;
Abstract
A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness 'tf' of the conductor layer on the base film formed in the flexible region and the average thickness 'tR' of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.