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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9155195 B1

PDFFull Text
Date of Patent:
Oct. 06, 2015

Filed:

Apr. 30, 2013

Wiring board and semiconductor device

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Junichi Nakamura, Nagano, JP;

Yuji Kobayashi, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 7/10 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H05K 3/20 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H05K 3/4007 (2013.01); H05K 3/421 (2013.01); H01L 21/563 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/15311 (2013.01); H05K 1/116 (2013.01); H05K 3/205 (2013.01); H05K 3/28 (2013.01); H05K 3/3473 (2013.01); H05K 3/423 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/0949 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/0361 (2013.01); H05K 2203/1536 (2013.01); Y10T 29/49126 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.

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