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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153521 B1

PDFFull Text
Expired
Date of Patent:
Oct. 06, 2015

Filed:

Jun. 16, 2011

Method of manufacturing a package carrier

Applicant:

Shih-hao Sun, Hsinchu County, TW;

Inventor:

Shih-Hao Sun, Hsinchu County, TW;

Assignee:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Sarang Afzali

Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01C 17/02 (2006.01); H01L 23/367 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01C 17/02 (2013.01); H01L 23/367 (2013.01); H01L 23/13 (2013.01); H01L 23/498 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2933/0075 (2013.01); Y10T 29/49083 (2015.01); Y10T 29/49087 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49353 (2015.01);
Abstract

A method of manufacturing a package carrier is provided. An insulation cover is provided. The insulation cover has an inner surface and an outer surface opposite to each other, a plurality of openings, and a containing space. A patterned metal layer is formed on the outer surface of the insulation cover. A surface treatment layer is formed on the patterned metal layer. A heat dissipation element is formed in the containing space of the insulation cover and structurally connected to the insulation cover. A thermal-conductive layer is formed on a surface of the heat dissipation element, and a portion of the thermal-conductive layer is exposed by the openings of the insulation cover.

Find Patent Forward Citations

Sun, Shih-Hao. (2015). Method of manufacturing a package carrier (U.S. Patent No. 9153521). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153521

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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