The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Jan. 16, 2013
Applicant:
Micro Processing Technology, Inc., Lafayette, CA (US);
Inventor:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Assignee:
Micro Processing Technology, Inc., Lafayette, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01);
Abstract
A system for separating semiconductor devices from a wafer having back metal exposed in scribe streets of the wafer positioned on a plastic film by applying a variable radial force to stretch and tension the film while controlling the stretch and tension as a function of a control parameter.
Lindsey, Jr., Paul. (2015). System for separating devices from a semiconductor wafer (U.S. Patent No. 9153493). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153493
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile