The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Dec. 05, 2013
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
I-Shuo Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
Systems and methods are provided for performing chemical-mechanical planarization on an article. An example system includes a polishing head, a polishing pad, a light source, a polishing fluid, a current detector, and one or more processors. The polishing head is configured to perform chemical-mechanical planarization (CMP) on an article. The polishing pad is configured to support the article. The light source is configured to emit an incident light. The polishing fluid is configured to perform CMP including a plurality of light-absorption particles being capable of transferring charges to a stop layer in the article in response the incident light. The current detector is configured to detect a current in response to the light-absorption particles transferring charges to the stop layer. The one or more processors are configured to control the polishing head based on the detected current.