The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Feb. 24, 2014
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Hidetaka Nakao, Tokyo, JP;

Soichi Isobe, Tokyo, JP;

Seiji Katsuoka, Tokyo, JP;

Naoki Matsuda, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/34 (2012.01); H01L 21/67 (2006.01); B24B 9/06 (2006.01);
U.S. Cl.
CPC ...
B24B 37/345 (2013.01); B24B 9/065 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67219 (2013.01);
Abstract

A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.


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