The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Oct. 13, 2009
Applicants:

Chao-hsing Chen, Hsinchu, TW;

Schang-jing Hon, Taichung, TW;

Alexander Chan Wang, Hsinchu, TW;

Li-tian Liang, Hsinchu, TW;

Chin-yung Fan, Hsinchu, TW;

Chien-kai Chung, Hsinchu, TW;

Min-hsun Hsieh, Hsinchu, TW;

Inventors:

Chao-Hsing Chen, Hsinchu, TW;

Schang-Jing Hon, Taichung, TW;

Alexander Chan Wang, Hsinchu, TW;

Li-Tian Liang, Hsinchu, TW;

Chin-Yung Fan, Hsinchu, TW;

Chien-Kai Chung, Hsinchu, TW;

Min-Hsun Hsieh, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 27/02 (2006.01); H01L 25/065 (2006.01); H01L 25/075 (2006.01); H01L 27/32 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/3211 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A light-emitting device is provided that is capable of being directly connected to an alternative current source, including at least one electronic element; at least one light-emitting diode array chip; at least one bonding pad, a conductive trace, and a submount for supporting the electronic element, the light-emitting diode array chip, the bonding pad, and the conductive trace. The conductive trace is electrically connected to the electronic element, the light-emitting diode array chip, and bonding pad.


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