The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9142422 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 22, 2015

Filed:

Nov. 04, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Hung-Wei Liu, Saratoga Springs, NY (US);

Zhiguo Sun, Halfmoon, NY (US);

Huang Liu, Mechanicville, NY (US);

Jin Ping Liu, Ballston Lake, NY (US);

Assignee:

GLOBALFOUNDRIES INC, Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31111 (2013.01); H01L 23/58 (2013.01);
Abstract

Methods of facilitating fabrication of defect-free semiconductor structures are provided which include, for instance: providing a dielectric layer, the dielectric layer comprising at least one consumable material; selectively removing a portion of the dielectric layer, wherein the selectively removing consumes, in part, a remaining portion of the at least one consumable material, leaving, within the remaining portion of the dielectric layer, a depleted region; and subjecting the depleted region of the dielectric layer to a treatment process, to restore the depleted region with at least one replacement consumable material, thereby facilitating fabrication of a defect-free semiconductor structure.


Find Patent Forward Citations

Liu, Hung-Wei. (2015). Methods of fabricating defect-free semiconductor structures (U.S. Patent No. 9142422). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9142422

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