The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Jun. 16, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Hans-Joachim Schulze, Taufkirchen, DE;

Alexander Susiti, Stadelbach, AT;

Markus Zundel, Egmating, DE;

Reinhard Ploss, Unterhaching, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/02 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 21/3115 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02123 (2013.01); H01L 21/02129 (2013.01); H01L 21/02321 (2013.01); H01L 21/3115 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 29/06 (2013.01); H01L 29/1095 (2013.01); H01L 29/4916 (2013.01); H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/7397 (2013.01); H01L 29/7802 (2013.01); H01L 29/7809 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 29/0696 (2013.01); H01L 29/407 (2013.01); H01L 29/4236 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes forming a continuous silicate glass structure over a first surface of a semiconductor body, including a first part of the continuous glass structure over an active area of the semiconductor body and a second part of the continuous glass structure over an area of the semiconductor body outside of the active area. A first composition of dopants included in the first part of continuous glass structure differs from a second composition of dopants of the second part of the continuous glass structure.


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