The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Apr. 12, 2011
Benoit Maison, Wavre, BE;
Andy Hill, San Jose, CA (US);
Laurent Hermans, Borsbeek, BE;
Frans Nijs, Leopoldsburg, BE;
Karel Van Gils, Blanden, BE;
Christophe Wouters, Balen, BE;
Benoit Maison, Wavre, BE;
Andy Hill, San Jose, CA (US);
Laurent Hermans, Borsbeek, BE;
Frans Nijs, Leopoldsburg, BE;
Karel Van Gils, Blanden, BE;
Christophe Wouters, Balen, BE;
KLA-Tencor Corporation, Milpitas, CA (US);
Abstract
An apparatus () and a method for the three dimensional inspection of saw marks () on at least one surface () of a wafer () are disclosed. At least one camera () is required to capture an image of the entire surface () of the wafer (). At least one line projector () provides a light bundle (), centered about a central beam axis (). The line projector () is arranged such that the central beam axis () is at an acute angle (α) with regard to the plane (P) of the wafer (). A line shifter () is positioned in the light bundle () between each line projector () and the surface () of the wafer (). A frame grabber () and an image processor () are used to synchronize and coordinate the image capture and the position of the pattern () of lines () on the front side (F) and/or the back side (B) of the wafer ().