The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Aug. 23, 2012
Kambiz Ansari, Singapore, SG;
Christina Yuan Ling Tan, Singapore, SG;
Yee Chong Loke, Singapore, SG;
Jarrett Dumond, Singapore, SG;
Isabel Rodriguez, Singapore, SG;
Kambiz Ansari, Singapore, SG;
Christina Yuan Ling Tan, Singapore, SG;
Yee Chong Loke, Singapore, SG;
Jarrett Dumond, Singapore, SG;
Isabel Rodriguez, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
Abstract
For forming a nickel mold, a metal and a corresponding etchant are selected such that the etchant selectively etches the metal over nickel. The metal is sputtered onto a surface of a template having nano-structures to form a sacrificial layer covering the nano-structures. Nickel is electroplated onto the sacrificial layer to form a nickel mold, but leaving a portion of the sacrificial layer exposed. The sacrificial layer is contacted with the etchant through the exposed portion of the sacrificial layer to etch away the sacrificial layer until the nickel mold is separated from the template. Subsequently, the nickel mold may be replicated or scaled-up to produce a replicate mold by electroplating, where the replicate mold has nano-structures that match the nano-structures on the template. The metal may be copper.