The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Nov. 13, 2012
Applicant:
Fujitsu Limited, Kawasaki, Kanagawa, JP;
Inventors:
Yoshitaka Yamaguchi, Kawasaki, JP;
Taisuke Iwai, Ebina, JP;
Seiki Sakuyama, Isehara, JP;
Yoshihiro Mizuno, Kobe, JP;
Masaaki Norimatsu, Atsugi, JP;
Yukie Sakita, Atsugi, JP;
Koji Asano, Shinjyuku, JP;
Shinichi Hirose, Yokohama, JP;
Yohei Yagishita, Isehara, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 7/20 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 21/4817 (2013.01); H01L 21/56 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 24/29 (2013.01); H01L 23/42 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16251 (2013.01);
Abstract
An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.