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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9137890 B1

PDFFull Text
Date of Patent:
Sep. 15, 2015

Filed:

Feb. 11, 2014

Wiring board and light emitting device

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Kazutaka Kobayashi, Nagano, JP;

Mitsuhiro Aizawa, Nagano, JP;

Hiroshi Shimizu, Nagano, JP;

Mina Iwai, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 7/10 (2006.01); H05K 1/02 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H05K 3/24 (2006.01); H05K 3/26 (2006.01); H05K 3/28 (2006.01); H01L 25/075 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05K 3/243 (2013.01); H05K 3/26 (2013.01); H05K 3/285 (2013.01); H01L 25/0753 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01); H05K 3/007 (2013.01); H05K 3/06 (2013.01); H05K 3/187 (2013.01); H05K 3/287 (2013.01); H05K 3/303 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/09881 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10553 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/075 (2013.01); H05K 2203/087 (2013.01); H05K 2203/095 (2013.01); H05K 2203/107 (2013.01);
Abstract

There is provided a wiring board. The wiring board includes: a first insulating layer; a plurality of wiring patterns on the first insulating layer so as to be spaced apart from each other; a plating layer on at least one of the wiring patterns; a second insulating layer containing silicone therein and having an opening, wherein an outermost surface of the plating layer is exposed from the opening and serves as a connection pad; and a silica film on the outermost surface of the plating layer.

Find Patent Forward Citations

Kobayashi, Kazutaka. (2015). Wiring board and light emitting device (U.S. Patent No. 9137890). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9137890

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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