The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Feb. 11, 2014
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Inventors:
Kazutaka Kobayashi, Nagano, JP;
Mitsuhiro Aizawa, Nagano, JP;
Hiroshi Shimizu, Nagano, JP;
Mina Iwai, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 7/10 (2006.01); H05K 1/02 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H05K 3/24 (2006.01); H05K 3/26 (2006.01); H05K 3/28 (2006.01); H01L 25/075 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05K 3/243 (2013.01); H05K 3/26 (2013.01); H05K 3/285 (2013.01); H01L 25/0753 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01); H05K 3/007 (2013.01); H05K 3/06 (2013.01); H05K 3/187 (2013.01); H05K 3/287 (2013.01); H05K 3/303 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/09881 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10553 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/075 (2013.01); H05K 2203/087 (2013.01); H05K 2203/095 (2013.01); H05K 2203/107 (2013.01);
Abstract
There is provided a wiring board. The wiring board includes: a first insulating layer; a plurality of wiring patterns on the first insulating layer so as to be spaced apart from each other; a plating layer on at least one of the wiring patterns; a second insulating layer containing silicone therein and having an opening, wherein an outermost surface of the plating layer is exposed from the opening and serves as a connection pad; and a silica film on the outermost surface of the plating layer.