The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Jun. 03, 2014
Applicant:

Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);

Inventors:

Sik Lui, Sunnyvale, CA (US);

Yi Su, Cupertino, CA (US);

Daniel Ng, Campbell, CA (US);

Daniel Calafut, San Jose, CA (US);

Anup Bhalla, Santa Clara, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 23/64 (2006.01); H01L 29/423 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7803 (2013.01); H01L 23/647 (2013.01); H01L 29/407 (2013.01); H01L 29/66734 (2013.01); H01L 29/7813 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 29/4238 (2013.01); H01L 29/42368 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A trench formed in a body layer and epitaxial layer of a substrate is lined with a dielectric layer. A shield electrode formed within a lower portion of the trench is insulated by the dielectric layer. A gate electrode formed in the trench above the shield electrode is insulated from the shield electrode by another dielectric layer. One or more source regions formed within the body layer is adjacent a sidewall of the trench. A source pad formed above the body layer is electrically connected to the source regions and insulated from the gate electrode and shield electrode. The source pad provides an external contact to the source region. A gate pad provides an external contact to the gate electrode. A shield electrode pad provides an external contact to the shield electrode. A resistive element is electrically connected between the shield electrode pad and a source lead.


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