The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Feb. 03, 2014
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Terry Lee Sterrett, Cave Creek, AZ (US);
Richard J. Harries, Chandler, AZ (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B29C 70/58 (2006.01); B29C 70/88 (2006.01); C08J 5/10 (2006.01); C08L 101/12 (2006.01); H05K 3/32 (2006.01); B29C 39/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); B29C 70/58 (2013.01); B29C 70/882 (2013.01); C08J 5/10 (2013.01); C08L 101/12 (2013.01); H01L 24/10 (2013.01); H01L 24/13 (2013.01); H05K 3/321 (2013.01); B29C 39/026 (2013.01); B29L 2031/3406 (2013.01); H01L 2224/13099 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/30107 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10719 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24917 (2015.01);
Abstract
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.