The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Sep. 10, 2012
Kenta Uchiyama, Nagano, JP;
Kenta Uchiyama, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor package includes a first semiconductor chip including a target circuit surface and a side surface, a first sealing insulating layer including a first surface positioned toward the target circuit surface and configured to seal the target circuit surface and the side surface, at least one wiring layer formed on the first surface of the first sealing insulating layer, at least one insulating layer formed on the at least one wiring layer, a second semiconductor chip mounted on the at least one insulating layer, and a second sealing insulating layer formed on the at least one insulating layer and configured to seal the second semiconductor chip.