The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Nov. 06, 2009
Shoa Siong Lim, Singapore, SG;
Klan Hock Lim, Singapore, SG;
Shoa Siong Lim, Singapore, SG;
Klan Hock Lim, Singapore, SG;
ADVANPACK SOLUTIONS PTE. LTD., Kallang, SG;
Abstract
A manufacturing method includes the follow steps. Firstly, a carrier is provided. Then, a plurality of traces are formed on the carrier. Then, a trace molding compound layer is formed on the carrier by a first molding process. Then, the carrier is removed from the trace molding compound layer to expose an etched surface of the trace molding compound layer and trace upper surfaces of the traces. Then, at least a chip is disposed on the etched surface of the trace molding compound layer and the chip is connected to the trace upper surfaces. Then, a chip molding compound layer is formed on the etched surface by a second molding process substantially similar to the first molding process, wherein the chip molding compound layer and the trace molding compound layer are formed of substantially the same molding compound material.