The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Jan. 17, 2012
Shunsuke Nagai, Ibaraki, JP;
Masato Miyatake, Ibaraki, JP;
Tomohiko Kotake, Ibaraki, JP;
Shintaro Hashimoto, Ibaraki, JP;
Yasuo Inoue, Ibaraki, JP;
Shin Takanezawa, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
Shunsuke Nagai, Ibaraki, JP;
Masato Miyatake, Ibaraki, JP;
Tomohiko Kotake, Ibaraki, JP;
Shintaro Hashimoto, Ibaraki, JP;
Yasuo Inoue, Ibaraki, JP;
Shin Takanezawa, Ibaraki, JP;
Hikari Murai, Ibaraki, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.