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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9133308 B1

PDFFull Text
Date of Patent:
Sep. 15, 2015

Filed:

Jan. 17, 2012

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

Applicants:

Shunsuke Nagai, Ibaraki, JP;

Masato Miyatake, Ibaraki, JP;

Tomohiko Kotake, Ibaraki, JP;

Shintaro Hashimoto, Ibaraki, JP;

Yasuo Inoue, Ibaraki, JP;

Shin Takanezawa, Ibaraki, JP;

Hikari Murai, Ibaraki, JP;

Inventors:

Shunsuke Nagai, Ibaraki, JP;

Masato Miyatake, Ibaraki, JP;

Tomohiko Kotake, Ibaraki, JP;

Shintaro Hashimoto, Ibaraki, JP;

Yasuo Inoue, Ibaraki, JP;

Shin Takanezawa, Ibaraki, JP;

Hikari Murai, Ibaraki, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Kuo-Liang Peng

Int. Cl.
CPC ...
C08G 77/26 (2006.01); C08G 77/14 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); H05K 1/03 (2006.01); C08L 83/06 (2006.01); C08K 5/13 (2006.01); C08K 5/18 (2006.01); C08K 5/3415 (2006.01); C08K 5/3445 (2006.01); C08G 73/06 (2006.01); C08G 77/388 (2006.01);
U.S. Cl.
CPC ...
C08G 77/14 (2013.01); C08J 5/24 (2013.01); C08L 79/085 (2013.01); C08L 83/06 (2013.01); H05K 1/0313 (2013.01); H05K 1/0353 (2013.01); C08G 73/0655 (2013.01); C08G 77/26 (2013.01); C08G 77/388 (2013.01); C08J 2379/08 (2013.01); C08K 5/13 (2013.01); C08K 5/18 (2013.01); C08K 5/3415 (2013.01); C08K 5/3445 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0162 (2013.01);
Abstract

There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

Find Patent Forward Citations

Nagai, Shunsuke. (2015). Resin composition, and printed wiring board, laminated sheet, and prepreg using same (U.S. Patent No. 9133308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9133308

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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