The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Aug. 26, 2014
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 1/20 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 3/047 (2006.01); B23K 3/08 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/206 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 1/203 (2013.01); B23K 3/047 (2013.01); B23K 3/08 (2013.01); H01L 21/67092 (2013.01); H01L 21/67173 (2013.01); H01L 21/67207 (2013.01); H01L 24/742 (2013.01); H01L 24/75 (2013.01); B23K 2201/40 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/2746 (2013.01); H01L 2224/2781 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27826 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/834 (2013.01); H01L 2224/83013 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/94 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1461 (2013.01);
Abstract
In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.