The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Feb. 09, 2011
Shinsuke Asada, Tokyo, JP;
Kenjiro Nagao, Tokyo, JP;
Dai Nakajima, Tokyo, JP;
Yuetsu Watanabe, Tokyo, JP;
Yoshihito Asao, Tokyo, JP;
Takuya Oga, Tokyo, JP;
Masaki Kato, Tokyo, JP;
Shinsuke Asada, Tokyo, JP;
Kenjiro Nagao, Tokyo, JP;
Dai Nakajima, Tokyo, JP;
Yuetsu Watanabe, Tokyo, JP;
Yoshihito Asao, Tokyo, JP;
Takuya Oga, Tokyo, JP;
Masaki Kato, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A power semiconductor module () includes: an electrode plate () in which a body portion () and an external connection terminal portion () are integrally formed, and the body portion () is arranged on the same flat surface; a semiconductor chip () mounted on one surface (mounting surface) () of the body portion (); and a resin package () in which the other surface (heat dissipation surface) () of the body portion () is exposed, and the body portion () of the electrode plate () and the semiconductor chip () are sealed with resin. The heat dissipation surface () is the same surface as the bottom () of the resin package (); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.