The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Apr. 12, 2013
Tong Hsing Electronic Industries, Ltd., Taipei, TW;
Wen-Chung Chiang, Lujhu Township, TW;
TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei, TW;
Abstract
A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copperplate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile