The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Jul. 15, 2014
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Hsiao-Tsung Yen, Tainan, TW;
Min-Chie Jeng, Taipei, TW;
Victor Chih Yuan Chang, Hsin-Chu, TW;
Chin-Wei Kuo, Zhubei, TW;
Yu-Ling Lin, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An apparatus for de-embedding through substrate vias is provided. The apparatus may include pads on a first side of a substrate are coupled to through vias extending through a substrate, wherein pairs of the through vias are interconnected by transmission lines of varying lengths along a second side of the substrate. The apparatus may further include pairs of pads coupled together by transmission lines of the same varying lengths. Apparatuses may include through vias surrounding a through via device under test. The surrounding through vias are connected to the through via device under test by a backside metal layer. The apparatus may further include a dummy structure having an area equal to an area of the backside metal layer.