The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2015
Filed:
Apr. 15, 2013
Applicant:
Foxconn Technology Co., Ltd., New Taipei, TW;
Inventor:
Rung-An Chen, New Taipei, TW;
Assignee:
Foxconn Technology Co., Ltd., New Taipei, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An exemplary electronic assembly includes a heat spreader, a socket, and an electronic component received in the socket. The electronic component includes a substrate and a chip disposed at a center of the substrate. The chip contacts a bottom surface of the heat spreader. The electronic assembly further includes a pair of flexible fixtures. One end of each flexible fixture abuts against the heat spreader, and another end of each flexible fixture abuts against either the substrate or the socket.