The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Jan. 11, 2013
Applicant:

International Rectifier Corporation, El Segundo, CA (US);

Inventor:

Hsueh-Rong Chang, Hermosa Beach, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/66 (2006.01); H01R 13/10 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01R 13/10 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/72 (2013.01); H01L 25/072 (2013.01); H01L 29/7393 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37639 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48132 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/84011 (2013.01); H01L 2224/8485 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/09511 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15798 (2013.01); H01L 2924/3641 (2013.01);
Abstract

According to one disclosed embodiment, a power semiconductor package includes an insulated-gate bipolar transistor (IGBT) residing on a package substrate, where the IGBT includes a plurality of solderable front metal (SFM) coated emitter segments situated atop the IGBT and connected to an emitter of the IGBT. The power semiconductor package also includes a conductive clip coupling the plurality of SFM coated emitter segments to an emitter pad on the package substrate. Additionally, the power semiconductor package includes a gate pad on the package substrate coupled to a gate of the IGBT, a collector pad on the package substrate situated under the IGBT and coupled to a collector of the IGBT, and an emitter terminal, a collector terminal and a gate terminal of the package substrate that are routed to the emitter pad, collector pad, and gate pad, respectively.


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