The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Jan. 06, 2014
Applicant:

Lasertec Corporation, Yokohama, Kanagawa, JP;

Inventor:

Haruhiko Kusunose, Kanagawa, JP;

Assignee:

LASERTEC CORPORATION, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/06 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); Y10T 29/49998 (2015.01); Y10T 279/11 (2015.01);
Abstract

A chucking device is provided, the chucking device having low dusting characteristics and high detergent properties, and being capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the chucking device is also provided. The chucking device vacuum-sucks and holds a wafer. The chucking device includes a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.


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