The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Dec. 28, 2011
Applicants:

Seung-hyun Lee, Daegu, KR;

Hyun-ki Lee, Daegu, KR;

Min-young Kim, Daegu, KR;

Jea-hong Lee, Ulsan, KR;

Inventors:

Seung-Hyun Lee, Daegu, KR;

Hyun-Ki Lee, Daegu, KR;

Min-Young Kim, Daegu, KR;

Jea-Hong Lee, Ulsan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/62 (2006.01); G06T 7/00 (2006.01); H05K 13/08 (2006.01); G01B 11/24 (2006.01); G01N 21/956 (2006.01); G01B 11/06 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0608 (2013.01); G01B 11/24 (2013.01); G01N 21/956 (2013.01); G06T 7/0004 (2013.01); G06T 7/0042 (2013.01); H05K 13/08 (2013.01); G01N 21/8806 (2013.01); G01N 2021/95638 (2013.01); G06T 2207/10004 (2013.01); G06T 2207/30141 (2013.01);
Abstract

A method of generating height information in a circuit board inspection apparatus, first, obtaining a first image corresponding to a first area and a second image corresponding to a second area with partially overlapped to the first area of a test board. Next, the first image and the second image are matched based on the overlapped area of the first and second area. Sequentially, a relative positional relationship of the first and second images is obtained from the result of matching. Sequentially, a combined grid image is generated by combining the first grid image and the second grid image based on the relative positioning relationship, wherein the first and second grid images are obtained by irradiating a grid patterned light toward a measurement object formed on the board inspection apparatus. Therefore, it is possible to generate an exact height information.


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