The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Jun. 19, 2012
Applicants:

Chuanzhi LI, Shenzhen, CN;

Hua Miao, Shenzhen, CN;

Zhanhao Xie, Shenzhen, CN;

Jun Peng, Shenzhen, CN;

Inventors:

Chuanzhi Li, Shenzhen, CN;

Hua Miao, Shenzhen, CN;

Zhanhao Xie, Shenzhen, CN;

Jun Peng, Shenzhen, CN;

Assignee:

Shennan Circuits Co., Ltd, Shenzhen, Guangdong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0298 (2013.01); H05K 3/0094 (2013.01); H05K 2201/09509 (2013.01);
Abstract

A printed circuit board (PCB), a method for processing PCB and an electronic apparatus. The method for processing PCB may comprise: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has a geoelectric layer thereon; and the metal matrix is fixed in a slot provided in the substrate, the formed hole contacts both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the geoelectric layer and the metal matrix are in conduction with each other.


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