The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Jun. 29, 2012
Applicants:
I-hsiung Huang, Hsinchu County, TW;
Heng-hsin Liu, New Taipei, TW;
Heng-jen Lee, Baoshan Township, TW;
Chin-hsiang Lin, Hsinchu, TW;
Inventors:
I-Hsiung Huang, Hsinchu County, TW;
Heng-Hsin Liu, New Taipei, TW;
Heng-Jen Lee, Baoshan Township, TW;
Chin-Hsiang Lin, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A wafer assembly includes a process wafer and a carrier wafer. Integrated circuits are formed on the process wafer. The carrier wafer is bonded to the process wafer. The carrier wafer has at least one alignment mark.