The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Jul. 11, 2011
Applicants:

Da-jung Chen, Hsinchu, TW;

Kaipeng Chiang, Hsinchu, TW;

Yu-chao Fang, Hsinchu, TW;

Yi-cheng Lin, Hsinchu, TW;

Inventors:

Da-Jung Chen, Hsinchu, TW;

Kaipeng Chiang, Hsinchu, TW;

Yu-Chao Fang, Hsinchu, TW;

Yi-Cheng Lin, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/06 (2006.01); H05K 7/08 (2006.01); H05K 7/10 (2006.01); H01L 23/64 (2006.01); H01L 23/552 (2006.01); H01L 25/07 (2006.01); H02M 3/155 (2006.01); H02M 7/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 23/552 (2013.01); H01L 25/072 (2013.01); H02M 3/155 (2013.01); H02M 7/003 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1904 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.


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