The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Dec. 31, 2012
Memc Singapore Pte. Ltd. (Uen200614794d), Singapore, SG;
Jihong John Chen, St. Charles, MO (US);
Susan S. Dwyer, Collinsville, IL (US);
Shawn Wesley Hayes, Foristell, MO (US);
Thomas E. Doane, Troy, MO (US);
Dale A. Witte, Wentzville, MO (US);
Linda K. Swiney, St. Charles, MO (US);
Travis L. Hambach, Warrenton, MO (US);
MEMC Singapore Pte., Ltd. (UEN200614794D), Singapore, SG;
Abstract
A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.