The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Jul. 08, 2011
Ming-chi Chen, Hsinchu Hsiang, TW;
Horng-kuang Fan, Hsinchu Hsiang, TW;
Mao-fa Shen, Hsinchu Hsiang, TW;
Ming-chu Chueh, Hsinchu Hsiang, TW;
Bang-shun Liu, Hsinchu Hsiang, TW;
Che-wei Lin, Hsinchu Hsiang, TW;
Ming-Chi Chen, Hsinchu Hsiang, TW;
Horng-Kuang Fan, Hsinchu Hsiang, TW;
Mao-Fa Shen, Hsinchu Hsiang, TW;
Ming-Chu Chueh, Hsinchu Hsiang, TW;
Bang-Shun Liu, Hsinchu Hsiang, TW;
Che-Wei Lin, Hsinchu Hsiang, TW;
MPI Corporation, Chu-Pei, TW;
Abstract
A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.