The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Dec. 10, 2008
Applicants:
Kwang Choon Chung, Gyeonggi-do, KR;
Ji Hoon Yoo, Gyeonggi-do, KR;
Byung Hun Kim, Gyeonggi-do, KR;
Su Han Kim, Daejeon, KR;
Inventors:
Kwang Choon Chung, Gyeonggi-do, KR;
Ji Hoon Yoo, Gyeonggi-do, KR;
Byung Hun Kim, Gyeonggi-do, KR;
Su Han Kim, Daejeon, KR;
Assignee:
Inktec Co., Ltd., Kyeongki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); B05D 5/12 (2006.01); B05D 5/06 (2006.01); H05K 3/12 (2006.01); H05K 3/00 (2006.01); C23C 18/18 (2006.01); C23C 18/20 (2006.01); C23C 18/16 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1258 (2013.01); C23C 18/165 (2013.01); C23C 18/1868 (2013.01); C23C 18/204 (2013.01); H05K 1/097 (2013.01); H05K 3/0026 (2013.01); H05K 3/107 (2013.01); H05K 3/245 (2013.01); H05K 2201/0112 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/0568 (2013.01);
Abstract
The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.